RO4003C 4-Layer 1.8mm Thick PCB with ENIG Finish and Blind Vias
1.Introduction
Rogers RO4003C materials are proprietary woven glass-reinforced hydrocarbon/ceramic laminates that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. These materials are ideal for high-frequency applications, offering tight control over dielectric constant (Dk) and low loss at a fraction of the cost of conventional microwave laminates. Unlike PTFE-based materials, RO4003C requires no special through-hole treatments, making it easier to process like standard FR-4 while delivering superior RF performance.
With a thermal coefficient of expansion (CTE) closely matched to copper, RO4003C ensures excellent dimensional stability, critical for mixed dielectric multi-layer boards. Its low Z-axis CTE enhances plated through-hole reliability, even under severe thermal shock conditions. The material’s high Tg (>280°C) guarantees stability across all circuit processing temperatures.
2.Key Performance Features
Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz
Dissipation Factor (Df): 0.0027 at 10GHz, 0.0021 at 2.5GHz
Thermal Conductivity: 0.71 W/m/°K
CTE: X: 11 ppm/°C, Y: 14 ppm/°C, Z: 46 ppm/°C
Low Moisture Absorption: 0.06%
Thermal Stability: Tg >280°C (536°F)
Benefits
Ideal for multi-layer RF/microwave designs
Cost-effective fabrication (FR-4 compatible processes
Reliable performance in high-volume applications
3.PCB Specifications at a Glance
| Parameter | Specification |
|---|---|
| Base Material | RO4003C / RO4450F |
| Layer Count | 3 Layers |
| Board Dimensions | 291mm x 155mm (2 types, 2 pieces) ±0.15mm |
| Min Trace/Space | 5/4 mils |
| Min Hole Size | 0.3mm |
| Blind Vias | Top Layer to Inner Layer 1 |
| Finished Thickness | 1.82mm |
| Copper Weight (Outer/Inner) | 1oz (35µm) / 1oz (35µm) |
| Via Plating Thickness | 20µm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Black |
| Bottom Solder Mask | None |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup: 3-layer rigid PCB
| Layer | Material | Thickness |
|---|---|---|
| Copper Layer 1 (Top) | Copper | 35 μm |
| Core 1 | Rogers 4003C | 0.813 mm (32 mil) |
| Copper Layer 2 | Copper | 35 μm |
| Bonding Ply | RO4450F | 0.102 mm (4 mil) |
| Core 2 | Rogers 4003C | 0.813 mm (32 mil) |
| Copper Layer 3 (Bottom) | Copper | 35 μm |
5.PCB Statistics:
Components: 32
Total Pads: 141
Thru Hole Pads: 73
Top SMT Pads: 68
Bottom SMT Pads: 0
Vias: 37
Nets: 5
6.Typical Applications
Cellular Base Station Antennas
RF Identification Tags
Automotive Radar/Sensors
Satellite LNB Circuits
7.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support